The CMP (Chemical Mechanical Planarization) method relies on several nanoscale surface interaction processes, and so does a successful CMP result. Irrespective of whether your ambition is to develop and customize high performing slurries, to improve contamination control, or to achieve reliable CMP protocols, it all starts with an understanding, and control of, the surface-molecule interactions involved.
In this overview, we present how QSense® QCM-D technology can be used in molecule-surface interaction analysis and optimization of CMP related processes. We also demonstrate what information QSense measurements offer.
This overview includes analysis of: 
- Additive - surface interaction
- Residue removal
- Surface etching
