white paper

How to use contact angle measurements to predict adhesion and bonding?

This white paper is written to give its reader an overview of how contact angle measurements can be utilized to predict adhesion and bonding in various applications

white paper details

  • Length
    13 pages
  • Technologies
    Optical tensiometer
predict adhesion and bonding

In this white paper:

  • Adhesion troubleshooting checklist to guide you through the problem-solving.
  • Recommendations for the best measurements.
  • Scientific background to the adhesion problems.
  • An extensive list of references to get further information.

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